Market research

3D IC and 2.5D IC Market – Global Share and Growth Factor till 2027

The global market for 3D IC and 2.5D IC is expected to witness a stellar growth in the coming few years of the forecast period. There are several notable trends and developments emerging in the global market that are paving the way for further development.

Trends such as 2D block assembly into 3D chips, computing and data centers, hybrid memory cubes, and heterogeneous 3D integration are helping the development of the global 3D IC packaging market.

Looking for Regional Analysis or Competitive Landscape in 3D IC and 2.5D IC Market, ask for a customized report here

Global 3D IC and 2.5D IC Market – Notable Developments

The competitive landscape of the global 3D IC and 2.5D IC market is a fragmented one. Presence of multiple leading players in the market is the prime reason behind this fragmentation. However, there are a few established companies in the market that are consolidating their stronghold on the global market. The leading players in the 3D IC packaging market are concentrating on developing new and innovative products to cater to growing demand. Thus more focus is on product development. Heavy investments and funding are being put for the research and development activities.

Some of the leading companies in the global 3D IC and 2.5D IC market include names such as Samsung Electronics, Taiwan Semiconductor Manufacturing Company Ltd., Advanced Semiconductor Engineering Group, and Intel Corp among others.

  • Recently, Intel Corp announced that the company has released the latest version of its 3D IC and 2.5D IC packages in logic. The company is trying to dominate the advanced packaging in the field programmable gate arrays.

Need an overview of the report on 3D IC and 2.5D IC Market? Ask for the brochure here

Global 3D IC and 2.5D IC Market – Drivers and Restraints

There are number of factors that are proving to be pivotal in the growth of the global 3D IC and 2.5D IC market. One of the key driving factors for market growth has been the growing need for highly advanced circuit architecture in electronic product. These 3D IC and 2.5D IC packages are among the best electronic architecture available. Naturally, to cater to the growing needs of the consumers, their demand has been on the high in recent years. Thus, the growth of the market has been improving on a year on year basis.

Tags

Related Articles

Back to top button
Close